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Semiconductor Engineering Services

Engineeringtomorrow's silicon.

ZERLON SEMI delivers end-to-end VLSI & semiconductor engineering — from architecture and RTL to verification, physical design, embedded systems, and AI hardware. Study. Design. Innovate.

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Trusted by 35+ engineering teams — from fabless startups to Tier-1 OEMs.
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Powering silicon across the industry
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Global Clients
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Customer Satisfaction
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Successful Tapeouts
What We Do

Engineering intelligent silicon for a complex world.

We pair deep semiconductor expertise with modern VLSI methodologies and rigorous verification — delivering production-ready silicon that works the first time, from concept to post-silicon.

Explore our services

PPA-Optimized

Silicon tuned for power, performance, and area — cutting cost and time-to-market.

First-Pass Silicon

Verification and signoff discipline built to reach production-ready silicon first time.

Deep Expertise

Real specialists across ASIC/SoC, verification, physical design, and embedded.

Flexible Engagement

Scale a dedicated team up or down — turnkey, ODC, or staff augmentation.

How We Work

From first call to working silicon.

A clear, low-friction path — you always know what happens next.

1

Discovery

We learn your spec, node, tools, and quality gates — and where the real constraints are.

2

Proposal

A staffing or scope plan with clear deliverables, milestones, and success criteria.

3

Execution

The team ramps inside your perimeter and delivers against agreed gates, reviewed by engineers.

4

Delivery

Clean handoff — signed-off silicon and retained knowledge that leaves your team stronger.

Our Services

Five ways we take you from concept to silicon.

Engage us for one discipline or an end-to-end program. Every team ships against your tools, PDK, and quality gates.

01

Semiconductor Design Services

RTL design, verification, and physical design — from architecture to tapeout-ready GDSII.

RTLVerificationRTL2GDSIIDFT
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02

Automotive Semiconductor

ADAS, safety, and ISO 26262 — functional-safety silicon built to strict automotive standards.

ADASISO 26262AUTOSAR
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03

Embedded Engineering

BSP, RTOS, firmware, and Linux drivers — full-stack embedded from bare-metal to application.

BSPRTOSFirmwareLinux
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04

AI Engineering

NPU design and ML hardware architecture — accelerators for training and edge inference.

NPU DesignML HardwareNeural IP
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05

System Design Engineering

SoC architecture, integration, and system-level verification across disciplines — vision to certification.

SoC ArchitectureIntegrationSystem Verification
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Capabilities

Depth across the entire flow.

Front-end to back-end, embedded to AI — explore where our teams bring silicon-proven expertise.

RTL Design & Verification

Clean, synthesizable microarchitecture and exhaustive verification — the front-end foundation for first-pass silicon.

Synthesizable RTL
UVM testbenches
Formal verification
Coverage closure
CDC / lint clean
Low-power (UPF)
FRONT-END FLOW RTL DesignSystemVerilog TestbenchUVM · constrained-random Coveragefunctional + code SYNTHESIZED SoC CORE SIMULATION

Physical Design & DFT

RTL2GDSII with timing closure, physical signoff, and test structures — tapeout-ready on advanced nodes.

Floorplan & PnR
Timing closure
EM/IR & signoff
DRC / LVS clean
Scan & ATPG
MBIST
RTL2GDSII · PHYSICAL DESIGN SRAM SRAM PLL IO CPUcore Timing MET

Embedded Systems

Full-stack embedded — BSP, RTOS, Linux, and firmware — with hardware-software co-design so software ships with silicon.

BSP & bootloader
RTOS (FreeRTOS/Zephyr)
Embedded Linux
Device drivers
Arm & RISC-V
HW/SW co-design
FULL-STACK EMBEDDED Silicon / BoardSoC · peripherals · memory BSP & Driversbootloader · HAL · drivers RTOS / LinuxFreeRTOS · Zephyr · Yocto Firmware / Appapplication logic USER SPACE KERNEL / HW

AI Hardware

NPU microarchitecture and ML-optimized accelerators — co-designed with the models they run for maximum TOPS/W.

NPU design
Systolic arrays
Quantization
Sparsity
Edge inference
Neural IP
PEMACPEMACPEMACPEMACPEMACPEMACPEMACPEMACPEMACPEMACPEMACPEMACNPU · SYSTOLIC ARRAYWEIGHTSACTIVATIONSOptimized for TOPS/WINT8 · BF16
Our Design Flow

A disciplined path from concept to tape-out.

01

Architecture

Spec, PPA & microarchitecture.

02

RTL

Design & integration.

03

Verification

UVM, formal, coverage.

04

Physical Design

PnR, timing, signoff.

05

Tape-out

DRC/LVS-clean GDSII.

06

Validation

Bring-up & ramp.

Process Nodes

From bleeding-edge FinFET to mature nodes.

Proven physical-design flows across the process spectrum — we meet your product where it lives.

3nm
Advanced
AI / HPC accelerators
98%
5nm
Advanced
Mobile / AI SoCs
95%
7nm
Advanced
Networking & infrastructure
92%
16nm
Mainstream
Automotive & ADAS
88%
28nm
Mainstream
IoT / MCU / mixed-signal
82%
180nm
Legacy
Analog / power management
74%
Industries We Serve

Semiconductor depth across every industry.

From fabless startups to Tier-1 OEMs — we bring silicon expertise to your domain.

01

AI & Machine Learning

02

Automotive & ADAS

03

IoT & Smart Devices

04

Industrial Automation

05

Consumer Electronics

06

Networking & Telecom

07

High-Performance Computing

08

Healthcare & Medical

Why ZERLON SEMI

Built for first-pass success.

Scalable teams, precise execution, silicon-proven IP, and flexible engagement — faster time-to-market with superior quality.

01

Full-Stack Engineering

Architecture, RTL & verification, RTL2GDSII, and embedded — under one roof.

  • End-to-end ownership
  • Concept to silicon
02

Advanced Node Expertise

Proven flows from the latest FinFET nodes down to mature technologies.

  • 3nm / 5nm / 7nm
  • Node migration
03

Silicon-Proven IP

Production-tested RTL, analog, and verification IP — skip months of development.

  • RTL & analog IP
  • Verification IP
04

Flexible, Secure ODCs

Dedicated design centers on your tools and perimeter — scale on demand.

  • Turnkey / ODC / staff aug
  • Security-certified
The Difference

Why teams switch to us.

What working with an outcome-owned engineering partner actually feels like.

Typical vendor

Bodies on a contract
  • Hand-offs with gaps between stages
  • Accountability diffused across teams
  • Knowledge walks out at project end
  • Rigid, one-size engagement
  • Quality checked at the end

ZERLON SEMI

An engineering partner
  • End-to-end ownership across the flow
  • One team accountable to the outcome
  • Knowledge that compounds with you
  • ODC, turnkey, or staff aug — your call
  • Quality gates at every stage
By the Numbers

Engineering outcomes that compound.

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Successful Tapeouts
Across nodes & industries
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Engineers
Specialists, full lifecycle
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First-Pass Success
On delivered blocks
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In Semiconductor
Since 2013
What Clients Say

Trusted by engineering leaders worldwide.

★★★★★
"ZERLON SEMI took our block from RTL to signed-off GDSII on a node we'd never run — and hit the tape-out date when our own team was stuck. Their engineering discipline is unmatched."
AP
Amanda ParksVP Engineering, AI Hardware
★★★★★
"An outstanding engineering partner — professional, deeply knowledgeable, and relentlessly customer-driven. Their verification team found corner-case bugs our regressions had missed for months."
JL
John LabkinsCEO, Networking Scale-up
★★★★★
"A customer for years. ZERLON SEMI is the example of how semiconductor engineering services should be done — flexible, technical, and always focused on the outcome."
DL
Daniel LegranteCIO, Automotive Supplier
From Our Blog

Insights from the silicon frontier.

Engineering notes, industry perspective, and deep dives from the ZERLON SEMI team.

FAQ

Questions, answered.

Both. Engage us for a single discipline — RTL, verification, physical design, DFT, embedded, or AI hardware — or hand us the full program from architecture through tape-out and bring-up. We plug in wherever the depth is needed.

Three: a dedicated design center (ODC) on your tools and perimeter, fixed-scope turnkey projects with milestone accountability, or staff augmentation with vetted engineers embedded in your team. See the Engagement page for a full comparison.

From the latest FinFET nodes (3nm, 5nm, 7nm) through mainstream (16nm, 28nm) down to mature technologies (180nm and beyond) for analog and power. Our physical-design flows are proven across the spectrum.

Work happens inside your security perimeter where required, with access controls, traceability, and confidentiality terms appropriate to semiconductor design. Our ODCs are security-certified and every engagement is governed by a written agreement covering IP ownership.

Staff augmentation typically ramps in days to weeks; a dedicated design center in weeks to months depending on scope and clearance. We move as fast as access and onboarding allow, without cutting corners on quality.

Contact Us

Partner with us for expert silicon.

Tell us about your chip — the stage, the node, the timeline. No fluff, just engineering clarity.

1

We schedule a call at your convenience.

2

Discovery & consulting meeting with our engineers.

3

We prepare a detailed technical proposal.

+91 70266 33266

Schedule a free consultation

Typical response within 24 hours. No commitment required.
Thank you — your request has been sent. Our team will respond within 24 hours.

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Let's Build

Let's build the next generation of silicon.

From concept to tape-out — bring us your spec and we'll bring back working silicon.