ZERLON SEMI delivers end-to-end VLSI & semiconductor engineering — from architecture and RTL to verification, physical design, embedded systems, and AI hardware. Study. Design. Innovate.






We pair deep semiconductor expertise with modern VLSI methodologies and rigorous verification — delivering production-ready silicon that works the first time, from concept to post-silicon.
Explore our servicesSilicon tuned for power, performance, and area — cutting cost and time-to-market.
Verification and signoff discipline built to reach production-ready silicon first time.
Real specialists across ASIC/SoC, verification, physical design, and embedded.
Scale a dedicated team up or down — turnkey, ODC, or staff augmentation.
A clear, low-friction path — you always know what happens next.
We learn your spec, node, tools, and quality gates — and where the real constraints are.
A staffing or scope plan with clear deliverables, milestones, and success criteria.
The team ramps inside your perimeter and delivers against agreed gates, reviewed by engineers.
Clean handoff — signed-off silicon and retained knowledge that leaves your team stronger.
Engage us for one discipline or an end-to-end program. Every team ships against your tools, PDK, and quality gates.
RTL design, verification, and physical design — from architecture to tapeout-ready GDSII.
ADAS, safety, and ISO 26262 — functional-safety silicon built to strict automotive standards.
BSP, RTOS, firmware, and Linux drivers — full-stack embedded from bare-metal to application.
NPU design and ML hardware architecture — accelerators for training and edge inference.
SoC architecture, integration, and system-level verification across disciplines — vision to certification.
Front-end to back-end, embedded to AI — explore where our teams bring silicon-proven expertise.
Clean, synthesizable microarchitecture and exhaustive verification — the front-end foundation for first-pass silicon.
RTL2GDSII with timing closure, physical signoff, and test structures — tapeout-ready on advanced nodes.
Full-stack embedded — BSP, RTOS, Linux, and firmware — with hardware-software co-design so software ships with silicon.
NPU microarchitecture and ML-optimized accelerators — co-designed with the models they run for maximum TOPS/W.
Spec, PPA & microarchitecture.
Design & integration.
UVM, formal, coverage.
PnR, timing, signoff.
DRC/LVS-clean GDSII.
Bring-up & ramp.
Proven physical-design flows across the process spectrum — we meet your product where it lives.
From fabless startups to Tier-1 OEMs — we bring silicon expertise to your domain.
Scalable teams, precise execution, silicon-proven IP, and flexible engagement — faster time-to-market with superior quality.
Architecture, RTL & verification, RTL2GDSII, and embedded — under one roof.
Proven flows from the latest FinFET nodes down to mature technologies.
Production-tested RTL, analog, and verification IP — skip months of development.
Dedicated design centers on your tools and perimeter — scale on demand.
What working with an outcome-owned engineering partner actually feels like.
Engineering notes, industry perspective, and deep dives from the ZERLON SEMI team.
Both. Engage us for a single discipline — RTL, verification, physical design, DFT, embedded, or AI hardware — or hand us the full program from architecture through tape-out and bring-up. We plug in wherever the depth is needed.
Three: a dedicated design center (ODC) on your tools and perimeter, fixed-scope turnkey projects with milestone accountability, or staff augmentation with vetted engineers embedded in your team. See the Engagement page for a full comparison.
From the latest FinFET nodes (3nm, 5nm, 7nm) through mainstream (16nm, 28nm) down to mature technologies (180nm and beyond) for analog and power. Our physical-design flows are proven across the spectrum.
Work happens inside your security perimeter where required, with access controls, traceability, and confidentiality terms appropriate to semiconductor design. Our ODCs are security-certified and every engagement is governed by a written agreement covering IP ownership.
Staff augmentation typically ramps in days to weeks; a dedicated design center in weeks to months depending on scope and clearance. We move as fast as access and onboarding allow, without cutting corners on quality.
Tell us about your chip — the stage, the node, the timeline. No fluff, just engineering clarity.
We schedule a call at your convenience.
Discovery & consulting meeting with our engineers.
We prepare a detailed technical proposal.
From concept to tape-out — bring us your spec and we'll bring back working silicon.

Talk to our engineers about your chip — the stage, the node, the timeline.
Tell us a little about your project — no commitment required.
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