From AI accelerators to safety-critical automotive chips, from tiny IoT sensors to data-center compute — ZERLON SEMI brings deep, domain-aware engineering to the industries shaping the future.
Every sector has its own constraints — safety, power, cost, performance. We speak each one fluently.
A chip for an automobile and a chip for a wearable share the same physics — but almost nothing else. Safety standards, power envelopes, thermal limits, cost targets, and reliability expectations differ enormously. We adapt our methodology, verification strategy, and signoff to each sector.
We work deeply across AI/ML, automotive and ADAS, IoT, industrial, consumer, networking/telecom, HPC, and healthcare — with methodology and signoff adapted to each sector's constraints.
Yes — for automotive we design to ISO 26262 up to ASIL-D, and we apply safety-conscious flows to medical and industrial silicon as well.
Absolutely. Whether your dominant constraint is power (IoT), safety (automotive), performance (HPC/AI), or cost (consumer), we tune the architecture, verification, and signoff accordingly.
Very likely. The underlying disciplines — design, verification, physical design, embedded, and AI hardware — transfer across domains. Tell us your application and we'll assess the fit.
Tell us about your domain and we'll bring the right expertise to your chip.

Talk to our engineers about your chip — the stage, the node, the timeline.
Tell us a little about your project — no commitment required.
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