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Semiconductor Design Services — ZERLON SEMI
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Semiconductor Design Services

From architecture and RTL to verification, physical design, and tapeout-ready GDSII — a complete, silicon-proven design flow built for first-pass success on advanced nodes.

Discuss Your Chip See the Flow
RTLVerificationRTL2GDSIIDFT3nm–180nm
RTL Verify Place & Route GDSII
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Tapeouts Delivered
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First-Pass Success
3nm
Advanced Nodes
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Design Engineers
What We Deliver

Every discipline of chip design, under one roof.

Engage one stage or an end-to-end program — each team ships against your PDK, tools, and quality gates.

RTL Design

Clean, synthesizable microarchitecture in SystemVerilog — CDC-clean, lint-clean, and low-power aware from day one.

Functional Verification

UVM environments, constrained-random, formal, and coverage closure that catch corner-case bugs before silicon.

Physical Design

Floorplanning, place-and-route, timing closure, and physical signoff — DRC/LVS-clean GDSII on the latest nodes.

DFT & Test

Scan insertion, ATPG, and MBIST for high fault coverage and manufacturable, testable silicon.

Analog & Mixed-Signal

PLLs, SerDes, data converters, and custom analog IP integrated cleanly with your digital core.

Silicon-Proven IP

Production-tested RTL, analog, and verification IP that skips months of ground-up development.

The Design Flow

A disciplined path from concept to silicon.

Every project runs the same rigorous flow — with defined gates, reviews, and signoff criteria at each stage — so quality is designed in, not inspected after.

  • Front-end: architecture, RTL, and verification with coverage-driven signoff.
  • Back-end: synthesis, PnR, timing, EM/IR, and physical verification.
  • Signoff: DRC/LVS-clean GDSII, ready for the foundry.
Architecture spec · PPA RTL Design SystemVerilog Verification UVM · formal Physical Design PnR · signoff Tape-out DRC/LVS clean
Tools & Nodes

Industry-standard flows, every foundry.

EDA ToolchainsSynopsys · Cadence · Siemens
Process Nodes3 / 5 / 7 / 16 / 28nm+
FoundriesTSMC · Samsung · GF
MethodologiesUVM · UPF · hierarchical
Proven Outcomes

Design that reaches working silicon.

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Successful Tapeouts
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First-Pass Success
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Global Clients
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In Semiconductor
FAQ

Questions, answered.

Yes. We run the complete flow — architecture, RTL, verification, DFT, synthesis, place-and-route, and physical signoff — delivering DRC/LVS-clean GDSII ready for the foundry. You can also engage us for any single stage.

Advanced FinFET nodes (3nm, 5nm, 7nm) through mainstream (16nm, 28nm) and mature technologies, across TSMC, Samsung, GlobalFoundries and others. We work in your PDK and toolchain.

Coverage-driven verification, formal methods, rigorous timing and physical signoff, and design reviews at every gate. Our verification IP and methodology are built specifically to catch corner cases before tape-out.

Yes — we operate inside your security perimeter and toolchain where required, with access controls and confidentiality terms appropriate to semiconductor design.

Let's Build

Bring us your spec. We'll bring back silicon.

From RTL to tape-out — a design partner accountable to the outcome, not just the hours.

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